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Stock Information Card: ASML Holdings N.V. (NASDAQ: ASML)

As of October 18, 2026

1. Company Overview

ASML Holding N.V. (ASML) is the world’s sole manufacturer of Extreme Ultraviolet (EUV) lithography machines and the dominant global provider of Deep Ultraviolet (DUV) lithography systems, metrology, inspection, and software solutions essential for advanced semiconductor fabrication.

  • Extreme Ultraviolet (EUV) Lithography: Proprietary, high-NA and low-NA EUV lithography platforms enabling top-tier semiconductor foundries (TSMC, Samsung, Intel, Micron) to mass-produce sub-3nm, 2nm, and advanced logic/memory microchips.
  • Deep Ultraviolet (DUV) Lithography & Metrology: Immersion and dry DUV lithography systems, holistic lithography software, and optical/e-beam inspection tools driving mature and advanced chip production.
  • Installed Base Management: High-margin field upgrades, productivity enhancements, software solutions, and maintenance services for ASML’s global active machine install base.
  • Exchange: NASDAQ / EURONEXT | Sector: Technology | Industry: Semiconductor Equipment & Materials
  • Headquarters: Veldhoven, Netherlands | CEO: Christophe Fouquet

2. Key Stock & Valuation Snapshot

MetricValueReference / Context
Stock Price$1,641.5252-Week Range: $946.11 – $1,999.96
Market Capitalization$646.07 Billion (€604.1 Billion)Monopoly provider of advanced semiconductor lithography equipment
Trailing P/E (TTM)36.2xPremium multiple supported by EUV monopoly, high visibility, and AI demand
Price / Book (P/B)23.5xSkewed high due to extreme return on capital (ROIC) and proprietary IP value
Diluted EPS (Q3 FY26)€12.47 ($14.65)Beat consensus (+55.0% YoY revenue growth); Full-Year FY26 EPS: ~$45.73 – $46.83
Dividend Yield (Forward)0.63%Annualized Dividend: ~$10.52/share (€9.60/share, paid quarterly)

3. Financial Performance (Q3 & TTM FY2026 Summary)

Reported on October 14, 2026, ASML delivered record third-quarter financial results and raised its full-year 2026 guidance, driven by accelerating AI chip infrastructure demand and high-margin Installed Base upgrades.

  • Total Operating Revenue: €11.66 Billion ($13.1B) in Q3 FY26 (+55.0% YoY); Full-Year FY26 Revenue projected at €44.0 Billion – €45.0 Billion ($49.0B–$50.0B).
  • Net Annual Profit: Q3 GAAP Net Income reached €5.00 Billion ($5.6B, +100%+ YoY); Trailing Twelve-Month (TTM) Net Income exceeds €17.6 Billion.
  • Gross Margin: 57.5% in Q3 FY26 (above guidance, driven by high-margin field upgrades); Full-Year FY26 Gross Margin guided around 56.0%.
  • Operating Cash Flow: ~€17.7 Billion TTM, demonstrating incredible cash conversion from global chipmaker capex programs.
  • Segment Breakdown: EUV Systems €4.1 Billion; Non-EUV (DUV) Systems €4.3 Billion; Installed Base Management €3.3 Billion (+29% YoY).

4. Quality Metrics Dashboard

Metric CategoryASML PerformanceTarget BenchmarkPass / Fail Status
EPS Growth Next 3 Years~24.5% Annualized> 7.0%PASS
EPS Growth Next Year~38.0% (Consensus FY27)> 7.0%PASS
ROCE~42.1%> 20.0%PASS
ROE (TTM)~52.6%> 10.0%PASS
5-Year Average ROE~48.2%> 10.0%PASS
ROIC (TTM)~24.6% – 27.3%> 15.0%PASS (Monopolistic pricing power)
5-Year Average ROIC~24.9%> 15.0%PASS
TTM Net Profit Margin35.6%> 10.0%PASS
5-Year Net Profit Margin31.2%> 10.0%PASS
TTM Gross Margin56.2%> 40.0%PASS
5-Year Gross Margin51.8%> 40.0%PASS
TTM Free Cash Flow Margin26.5%> 10.0%PASS
5-Year Free Cash Flow Margin24.1%> 10.0%PASS
FCF Conversion Ratio> 90.0%> 80.0%PASS
CAPEX to Revenue (TTM)~4.8%Asset-Light TargetPASS
5-Year CAPEX to Revenue~4.5%Asset-Light TargetPASS
TTM Revenue Growth27.5% (55.0% Q3 YoY)> 5.0%PASS
5-Year Revenue Growth18.2% CAGR> 5.0%PASS
TTM EPS Growth+45.5% YoY> 7.0%PASS
Last 5 Year EPS Growth22.6% CAGR> 7.0%PASS
Sloan Ratio+1.5%-10.0% to +10.0%PASS (High earnings quality)
Debt to Equity0.38xConservative LeveragePASS
Net Corporate Debt to EBITDANet Cash Position (€5.2B Cash vs €4.1B Debt)< 3.0xPASS (Fortress balance sheet)

5. Growth Catalysts

  • High-NA EUV Supercycle & 2nm/A16 Transitions: Widespread adoption of High-NA (0.55 NA) EUV lithography systems by TSMC, Intel, and Samsung for sub-2nm foundry nodes starting in 2026/2027.
  • Generative AI Infrastructure Buildout: Massive capital expenditure by global cloud hyperscalers driving demand for HBM3e/HBM4 high-bandwidth memory and advanced AI accelerators, directly requiring ASML’s lithography fleet.
  • Installed Base Upgrade Expansion: High-margin software and field productivity upgrades for existing DUV and EUV tools providing high-visibility recurring revenue streams beyond new machine sales.

6. Dividend & Capital Return Profile

  • Quarterly Dividend: ~$2.63 per share (€2.40/share, $10.52 annualized).
  • Dividend Track Record: 15+ consecutive years of annual dividend increases (~18.5% 5-year CAGR).
  • Payout Ratio: Conservative ~25%–30% of net income, preserving cash for high-yield R&D and capacity expansion.
  • Share Repurchases: Multi-billion-euro buyback program; repurchased ~€4.1 Billion in stock during Q3 2026 alone under its 2026–2028 capital return framework.

7. Historical Stock Returns

Time HorizonASML Total ReturnBenchmark / Context
1-Month+4.60%Outperformed broad semiconductor equipment indices
YTD (2026)+12.30%Rebounded strongly following Q3 earnings beat and raised guidance
1-Year+64.83%Massively outperformed global technology benchmarks
3-Year Return+127.88% (Cumulative)Dominant compounding performance driven by AI hardware demand
5-Year CAGR+18.2% (Annualized)World-class long-term wealth creator

8. SWOT Analysis

Strengths

  • Absolute global monopoly in EUV lithography equipment—no semiconductor manufacturer can produce advanced sub-7nm chips without ASML tools.
  • Exceptional quality profile: 56%+ gross margins, >24% ROIC, and ~35% net profit margins.
  • Unrivaled supply chain and R&D ecosystem backed by exclusive supplier partnerships (e.g., Carl Zeiss optics).

Weaknesses

  • High customer concentration, with top chipmakers (TSMC, Samsung, Intel) representing a major share of total revenue.
  • International export control regulations restricting advanced DUV and EUV system deliveries to mainland China.

Opportunities

  • Next-generation High-NA EUV tool commercialization enabling sub-2nm chip manufacturing through 2030+.
  • Expansion of high-margin Installed Base Management services across an expanding global active machine fleet.

Threats

  • Geopolitical trade restrictions and national security policy shifts between the US, Netherlands, and China.
  • Cyclical slowdowns or capex timing adjustments across memory and foundry capital allocation cycles.

9. Investment Thesis

Core Case: ASML Holding N.V. represents the ultimate technological “tollbooth” on the global semiconductor industry. As the world’s sole producer of EUV lithography machines, ASML holds an impenetrable economic moat over the entire advanced microchip manufacturing supply chain. Combining superior capital efficiency (>24% ROIC), high gross margins (56%+), and net cash balances with the structural tailwinds of Generative AI and High-NA EUV adoption, ASML remains an essential core holding for long-term compound growth investors.

10. Dividend Stockpile Score

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